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04-07-2002, 08:11 PM
VisionQuest Technologies Product?s is pleased to offer the next generation of thermal solutions for high power applications. The Liquicool design team has brought together four advanced cooling technologies to form an innovative, cost-effective, high performance liquid cooling system to meet our customer?s future needs. Integrating Magnetic Pump Module (MPM), Enhanced Fold Fin, Low Flow Resistance Cold Plates and Radiators, and Thermal Interface (i.e. Thermal Solders) technologies, liquid cooling has never been more practical or simpler to use. .
http://www.liquicool.com/gfx/installed.jpg
The MPM (enclosed within the radiator housing) combines both liquid pump and cooling fan, hence eliminating the need for separate power supplies, and controls. Cold plate and radiator components are constructed of copper for the highest possible heat transfer. Thermal solders allow for better wetting and high heat conduction between the processor and cold plate interface. Coolant volumes are kept to a minimum, and the system includes features to trap even the slightest leak.
Further Details found here (http://www.liquicool.com/product.html)
http://www.liquicool.com/gfx/installed.jpg
The MPM (enclosed within the radiator housing) combines both liquid pump and cooling fan, hence eliminating the need for separate power supplies, and controls. Cold plate and radiator components are constructed of copper for the highest possible heat transfer. Thermal solders allow for better wetting and high heat conduction between the processor and cold plate interface. Coolant volumes are kept to a minimum, and the system includes features to trap even the slightest leak.
Further Details found here (http://www.liquicool.com/product.html)